Technology consulting firm TechSearch International says the growth rate for the solder-bump market is more than 40 percent, and wafer-level chip-scale packaging is expected to experience double-digit growth in 2004. This concurrent growth comes from an increasing demand for chipsets, as well as wireless and graphics chips that require advanced packaging technology to meet performance and form-factor design rules.
(September 13, 2004) Singapore and Fremont, Calif.—STATS ChipPAC Ltd. today appointed Wan Choong Hoe as its new chief operating officer. Hoe has more than 25 years of manufacturing experience, and most recently served as vice president and managing director of Singapore and China operations for Nation Semiconductor Manufacturer Singapore Pte. Ltd. He holds an electrical and electronics engineering degree from the University of Singapore.