(October 21, 2004) Scotts Valley, Calif.—Carsem, a provider of turnkey packaging and test services to the semiconductor industry, announces that they have recently shipped their one billionth micro leadframe package (MLP).
(October 21, 2004) Scotts Valley, Calif.—Carsem, a provider of turnkey packaging and test services to the semiconductor industry, announces that they have recently shipped their one billionth micro leadframe package (MLP).
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