EV Group and Datacon Announce Cooperation on Advanced Chip-to-wafer Technology

The technology combines Datacon’s leading expertise in chip-bonding and key flip chip bonding technologies with the wafer-level know-how from EV Group. It has been developed in a joint R&D project.

(October 15, 2004) Ottawa, Ontario, Canada&#8212Ageus Solutions announces the launch of a complete, end-to-end WEEE compliance package. Ageus is now ready to provide full-service logistical, operational, financial, and engineering solutions for issues related to WEEE fulfillment.


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