Kester to Hold Lead-free Mini-Clinic at Mexitr

Kester understands that lead-free soldering is not a drop-in, and that careful selection of solder alloys, component-board finishes, flux chemistries and process optimization will be required. To maintain reliability and production yields, process engineers must gain the knowledge necessary to transition to lead-free.

(October 13, 2004) Phoenix, Ariz.&#8212FlipChip International (FCI) announces the opening of a Reliability & Design Center for wafer level packaging (WLP) and flip chip bumping technologies within its Phoenix, Ariz. facility.

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