In keeping with the growing trend toward high-performance, smaller form factor packages, WLCSP offers a combination of high functionality and the ultimate in miniaturization. As such, WLCSP has gained rapid acceptance as the package of choice for RF/analog, power management, and other devices used in handheld and portable products. According to Electronic Trend Publications, worldwide WLCSP volume is expected to increase at a CAGR of 17.9%, exceeding one billion units per year by 2008. WLCSP differs from fine-pitch ball grid array (BGA) and leadframe-based chip scale packages (CSPs), in that most of the packaging process steps are performed prior to the singulation of the die from the wafer. This new paradigm brings significant cost advantages by virtue of the fabrication processes being performed in parallel at the wafer level, rather than sequentially on individual chips.

(October 6, 2004) Clinton, N.Y.&#8212Indium Corporation of America announced the opening of their newest facility. Located in the Suzhou Industrial Park in Jiangsu, China, the facility houses solder-paste manufacturing and quality operations as well as fully integrated sales and technical support teams. This new facility offers prompt responses to customer needs to ensure world-class service throughout China.