“Our customers require high-density memory devices operating at low core voltage and low power,” says Juei-Lung Chen, GM at U-Chip. “Nexxim is the only simulator that provides the capacity, reliability, and transistor-level accuracy for the large circuits we design.”

(October 28, 2004) Austin, Texas&#8212Recently at the 11th Annual KGD Packaging & Test Workshop in Napa, Calif., the Die Products Consortium (DPC) presented the Industry Achievement Award to Jim Wolbert of Chip Supply Inc. for his leadership in developing international standards for semiconductor die products. The DPC presents the award annually to an individual for exemplary contributions to enlarging the world-wide markets for die products.