AIT Leverages Patented Technology with High-density Package Family

Based upon AIT’s newly confirmed patented technology, the advanced ELP framework leverages AIT’s world-class selective etching process, allowing tight integration of multiple I/Os into a reduced area. These new members of AIT’s leadframe-based package family are available in three unique variations, including etched leadless package (ELP), etched leadless package flip chip (ELPF), and etched leadless grid array (ELGA), allowing designers to choose a solution that best fits their system needs.

(November 4, 2004) San Jose, Calif.&#8212Worldwide silicon wafer area shipments in the third quarter increased 1% sequentially and 25% from the third quarter of 2003, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. Silicon wafer area shipments totaled 1,629 million sq. in. during the most recent quarter, compared to the 1,619 million sq. in. in shipments reported during the previous quarter.


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