Amkor, SECAP 300mm electroplated solder bumping line reaches volume production

November 11, 2004 – Amkor Technology Inc., its Unitive subsidiaries, and the Semiconductor Equipment Consortium for Advanced Packaging (SECAP) have established a high-volume 300mm electroplated solder bumping line, according to SECAP. The line, which was set up in 2003 at Unitive Semiconductor Taiwan (UST), located in Hsinchu, Taiwan, has reached volume production.

Originally announced in July 2002, SECAP and Unitive agreed to install a 300mm wafer bumping line to address the technical demands of wafer level packaging (WLP). After rapid qualification in May 2003, the line demonstrated full production capability in the first fully integrated 300mm electroplated wafer bumping line installed at a wafer level packaging service provider.

Amkor will expand capacity as required to meet customer demand. The Amkor 300mm wafer bumping line includes the following equipment from the SECAP equipment suppliers:
— SUSS MicroTec: coat/develop cluster, 1X full field mask aligner, and probe stations;
— Semitool: electroplating system, UBM etch, and resist strip tools;
— BTU International: integrated flux coater and reflow ovens;


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