The line is equipped for electroplated solder bumping and was set up in 2003 at Unitive Semiconductor Taiwan (UST), located in Hsinchu, Taiwan, as a joint project between the SECAP member companies and Unitive. The line has reached volume production and now serves Amkor’s top-tier, 300-mm customers. This venture accomplished SECAP’s mission to demonstrate to the advanced packaging industry a cost-effective equipment solution for 300-mm electroplated solder bumping.

Originally announced in July 2002, SECAP and Unitive agreed to install a 300-mm wafer bumping line to address the technical demands of wafer level packaging (WLP). After rapid qualification in May 2003, the line demonstrated full production capability in the first fully integrated, 300-mm electroplated wafer bumping line installed at a WLP service provider. The line is currently running volume production and Amkor will expand capacity as required to meet customer demand. With the acquisition of Unitive in August 2004, Amkor now provides a turnkey suite of flip chip solutions, including bumping on 200-mm and 300-mm wafers, probe, assembly, and final test.

(November 15, 2004) Morris Township, N.J.&#8212Honeywell announces that it has acquired Mitsubishi Chemical America’s 40% stake in GEM Microelectronics Materials, giving Honeywell sole ownership of the venture, which manufactures chemicals for the semiconductor industry.