Fairchild signs cooperative agreement with Beijing university

November 17, 2004 – Fairchild Semiconductor has signed a strategic multifaceted agreement with Tsinghua University, Beijing, China, establishing two IC R&D labs, one in Shanghai and one in Beijing, staffed by design engineers originating from Tsinghua University.

The employees at the Fairchild labs are tasked with developing and designing new products to support the company’s focus on optimizing system power in multiple end market applications.

The agreement also establishes the framework to:
— collaborate on University research projects;
— develop recruitment programs at Tsinghua University;
— have Fairchild technologists and other senior personnel serve as guest speakers at the school;
— develop academic outreach programs for Tsinghua students including site visits to Fairchild facilities; and
— underwrite a five-year grant to the University to further scholastic programs.


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