Modular Dispense Pump Cartridge
MRSI-175Ag epoxy dispenser now features a changeable pump cartridge for increased productivity and ease of use. The modular approach allows the machine to be switched from a die-attach, silver-filled, conductive epoxy application to a flip chip underfill application in just minutes. The updated pump system replaces the pump auger, chamber and dispense needle in a single, modular cartridge that can be removed and stored, even is still partially filled. Cartridge exchange is accomplished without tools, allowing the task to be performed quickly and easily. This technology advanced the utility of the dispenser, enabling it to deliver good results for both conductive epoxy and underfill dispensing applications, with one cartridge change. Newport Corp., Irvine, Calif., www.newport.com/apas.
Wave Solder Flux
Wave Solder Flux 3592-35 is developed for lead-free wave soldering of mixed-technology and through-hole electronic assemblies. It is a no-clean, halide-free material that provides enhanced heat stability for the higher temperatures required in lead-free wave soldering processes. The solvent-based formulation provides a wide process window and superior hole fill and solderability on all board finishes with minimized solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys. Indium Corporation of America, Clinton, N.Y, www.indium.com.
Reworkable Underfill Encapsulant
CN-1531, designed for CSP and BGA encapsulation, has a glass transition temperature of 110°C for more severe thermal cycle requirements. Removal of defective CSPs and BGAs is accomplished by heating the component and the underfill encapsulant to 220°C. Residues scrape or brush off with ease, and a viscosity of 5,000 cps at room temperature facilitates dispensing. It is capable of flowing a distance of 18 mm with single-side dispenses in 15 sec. Self-filleting, eliminates seal passes to create complete and symmetrical fillets. It cures in an in-line oven in 5 min. at 165°C. It is suitable for high-volume manufacturing of mobile phones and other handheld devices. Zymet Inc., East Hanover, N.J., www.zymet.com.
Gold, silver, and mixed-metal, low-loss 943 Green Tape material systems are available with blendable, embedded resistor compositions, having values of 20 and 200Ω per square. Surface resistor compositions are available with values from 10 to 10 kΩ per square in decade increments. Testing indicates minimal dielectric loss up to 77 GHz, and additional tests are planned for higher frequencies. It is Au- and Ag-compatible, has low TCE, high strength, and low loss at high frequencies. The system is available in 4 thicknesses and is designed for use as an insulating layer in high-frequency applications. DuPont Microcircuit Materials, Research Triangle Park, N.C. www.dupont.com/mcm.
Parallel Seam Sealer
Model 2400e parallel seam sealer incorporates closed-loop, software-controlled, six-axis coordinated motion, 5 lead screws, and a motorized rotary table with an electronic brake. The power supply uses digital signal processing for per-pulse power control. Automation features include pre-seal lid placement inspection with a grey-scale vision system, electrode height control with linear encoder feedback, real-time force and digital power control with package detection, resistance feedback, and on-off determination. It also seals in prototyping or smaller production volumes to include welding or soldering seal-in linear or rotary mode, parts one-up, in-matrix tooling, Auer boats to 12.3 × 5.1 in., and various shaped packages 2 mm2 to 12 × 8 in. Solid State Equipment Corp., Horsham, Penn., www.ssecusa.com.
Flip Chip Bonder
The 8800 FC Quantum platform enables high throughput in a single machine for various flip chip applications. The bonder's dual bonding system (DBS) executes individual bonding steps in parallel. It consists of 2 flip modules and 2 gantries — each fitted with a bond head and substrate camera, 2 slide fluxers, and 2 upward looking cameras. From one eject position, the tools of 2 flip units pick up the die in turn from a wafer. After the flip process, the die is picked, dipped in the slide fluxer, then measured relative to the tool by the upward looking camera, before being bonded onto the substrate. An “anti-collision arbiter” controls axis movement. The DBS enables the system to achieve up to 10,000 UPH throughput (dry cycle), simultaneously maintain constant, secure process times, and 10 µm at 3 sigma placement accuracy. Datacon North America Inc., Trevose, Pa., www.datacon.at.
X-ray Inspection System
XiDAT XD7600 provides for oblique angle views up to 70° for any position 360° around any point of the 18 × 16 in. inspection area. This manipulation allows inspection of all interconnections — ball, bond, and wire — on BGA and CSP devices. The inspector features NT250, a proprietary filament-free x-ray tube that provides feature recognition to 0.25 µm. The tube, coupled with standard active anti-vibration control, provides high-resolution image quality. The machine's operating system incorporates the latest revision of the company's point-and-click x-ray operating system. Dage Precision Industries Inc., Fremont, Calif., www.dageinc.com.
AQUANOX A4520 cleans reflowed no-clean and lead-free flux residues. The cleaner is effective on reflowed solder paste and uncured adhesives. It exceeds current SCAQMD requirements, is effective on solder joints, and shows no negative effect after multiple passes through the cleaning process. The solvent features inhibition technology that protects solder joints and bumps from oxidation. It is designed for use on aqueous batch or in-line spray machines, running clean, and exhibiting no foaming. The solvent is not classified as a corrosive, demonstrates extending tank life, removes gross contamination, is effective on no clean and lead free, and has moderate pH that does not require pretreatment. Kyzen Corp., Nashville, Tenn., www.kyzen.com.
Temperature Upgrade Option
The Pyramax 98 solder reflow oven is offered with an optional maximum operating temperature up to 400°C, specifically for lead-free processing. This represents a 75°C temperature increase over its conventional lead solder version. With the introduction of the higher-temperature model, the system can handle lead-free processing with a minimum reflow temperature of 240°C, as well as high lead with a minimum reflow temperature of 360°C. BTU International, North Billerica, Mass., www.btu.com.
Wafer Bumping Solder Paste
SE-CURE 7501 is designed for organic, in situ wafer bumping applications. The printing performance of the material features a stable viscosity over a manufacturing shift down to bump pitches below 125 µm for a consistent printing process module. The paste facilitates a low-cost bumping method, while enabling a high-quality end product. It is available in Sn63Pb37, as well as in low alpha (<0.02 cph/cm2) and ultra-low alpha (<0.002 cph/cm2) emitting Sn63Pb37. The paste also features consistent printing over a manufacturing shift to keep product yields high and costs manageable, printability on wafers of bump pitches below 125 µm, voiding occurrence rates that are consistently below 10%, and post-reflow residues that are stripped with other organic bumping materials. Kester, Des Plaines, Ill., www.kester.com.
Benchtop Dispensing System
DispenseMate 550 is a compact benchtop dispensing unit that offers advanced capability within a small footprint. Designed for various batch processes, including potting, form-in-place gasketing, solder paste and adhesive dispensing, and rework operations, the system offers a precision motion system with closed-loop brushless DC motors. Additional features include an integrated height sensor, digital gauges, and an optional vision system. The system is available in 2 models with different dispensing areas: the 555 has a dispense area of 525 × 525 mm, and the 553 has 325 × 325 mm. Asymtek, Carlsbad, Calif., www.asymtek.com.
The ALPHA Cored Wire series creates consistent flux cores and ensures repeatability with a Cpk rating of 1.826. Available in 10 tin/lead and lead-free alloys, the wire complies with various electronics assembly industry classifications, including J-STD-004, IPC-SF 818, and ISO 12224. The cored wire is created from a layer winding process that ensures consistent and smooth play-out for manual and automatic solder rework. It is packaged in color-coded spools to facilitate identification of the flux chemistry, and thick flanges reduce the risk of wire damage during transit. Color-coded labels also help with product identification by flux type and alloy, and shrink wrap keeps the wire shiny and clean both in transit and during storage. Cookson Electronics Assembly Materials, Jersey City, N.J., www.alphametals.com.
Flip Chip Bonder
A high-speed flip chip bonder, FCX501 is designed for the mass production of high-frequency electronics devices. The system is capable of ultrasonic and thermosonic flip chip bonding processes that create a nonmetallic bond with high thermal and electrical conductivity. The system can handle various interconnect technologies and die/substrate combinations. Additional benefits include 3,600 uph throughput, 0.5- to 10-mm-sq. die size and a small footprint. Panasonic Factory Automation, Elgin, Ill., www.panasonicfa.com.
Laser Fuse Processor
M435 fuse processing system, the next generation of WaferRepair, introduces the company's DVS energy management system that provides a stable, precise laser energy control architecture, which is necessary for processing fuse designs below 2-µm pitch. The system also features a small laser spot size of 1.4 µm, while enabling cuts at a 50,000-Hz rate. The processor combines the system accuracy, small spot size and throughput performance needed to address critical 90- and 70-nm production requirements. GSI Lumonics Inc., Wilmington, Mass., www.gsilumonics.com.
Brazed Copper Laminate Packages
A line of brazed copper laminate LDMOS packages are available that allow users to achieve a 16 to 18% improvement in Theta Jc, when compared to traditional CuW heat sinks. The package design provides high flange thermal dissipation, using the robust brazed assembly process. The brazed configuration does not require a change from the preferred Au/Si die-attach process. Ceramic RF power transistor packages are used in the 500-MHz to 3.5-GHz frequency range, and typically are found in cellular/digital base stations, HDTV transmitters, and numerous communication and avionic applications. Kyocera America Inc., San Diego, Calif., www.kyocera.com.
Automated Gold Wire Bonder
Model 8000 is for complex, precision gold wire bonding applications in which flexibility, ease of programming, and high throughput are needed, such as complex multichip applications, high I/O count devices and gold ball bumping for flip chip. The bonder incorporates a 12 × 6 in. X-Y range linear motor actuated positioner carrying a dual axes voice coil-driven bond head with a rectilinear Z-stroke of 20 mm. The Windows-NT software provides users with a programming environment for multichip, high pin count applications while incorporating many in-process monitoring tools. The large-area positioner enables a 72-sq.-in. work area, allowing large substrates to be bonded in one pass. The work area also accommodates dual handling systems for fast indexing and maximized throughput. Palomar Technologies, Vista, Calif., www.palomartechnologies.com.
Solderable Polymer Thick Film
PI-1000 is a screen-printable, directly solderable conductor that reduces manufacturing time and improves electrical and thermal performance of circuit interconnects vs. existing polymer thick films. The formulation develops true, robust metallurgical joints. Instead of relying on passive point-to-point contact, its active combination of continuous, micro-soldered metallic chains and interfaces is interwoven with a tough, thermosetting polymer, yielding electrical, thermal, and mechanical stability. The thick film can be screen printed or dispensed; the cured material requires no etching or post-bake. An additive manufacturing process allows fast cycle times, with no toxic wet chemicals and virtually no unusable waste. The technique eliminates typical copper-bearing acidic byproducts generated during conventional subtractive manufacturing. Dow Corning Corp., Midland, Mich., www.dowcorning.com.
Noncontact Measurement Sensor
This company's noncontact laser-based height measurement system is unaffected by shiny, translucent or multicolored surfaces such as wet epoxies, thick films, and inks. Its DRS digital sensor technology automatically compensates for variations in surface reflectivity, allowing the sensor to deliver accurate readings across a range of objects. The sensor is available with different resolutions and measurement ranges. It also is used on the company's Vantage and CT300 Series metrology systems, which use computer-controlled motion and software to produce high-resolution 2-D profiles and 3-D raster scans, which then produce a 3-D topographical map of microscale objects in applications such as LTCC inspection, solder paste inspection, and others, where objects may be wet, fragile, pliable, or highly contoured. Cyber Technologies USA, Ogdensburg, N.Y., www.cybertechnologiesUSA.com.
Combined Bonder/Tester System
This company offers a combination wire bonder and pull/shear test machine in one chassis. Model 5600 is the tester, while Model 5610 is the ball bonder. Both models can be converted to the other, and both machines offer manual and semiautomatic operation. The machines can be converted from wire bonder to pull test or shear test by simply exchanging the head cartridge. Such exchange features previously have been done on test equipment. With these systems, the wire bond and test capabilities have been blended. This design is a key machine investment for small production, startup companies, and R&D/university environments. It allows for one capital equipment expenditure, conserves valuable lab space, and offers the capability of six technologies: ball bonder, pull tester, die shear tester, ball shear tester, ball bonder and wedge bonder (scheduled for availability in early 2005). F&K Delvotec Inc., Foothill Ranch, Calif., www.fkdelvotecusa.com.
The Gamma resist processing system with AltaSpray coats severe topography and covers sharp edges, while offering high reproducibility, a necessity for volume production in thick-resist wafer bumping and MEMS/MOEMS volume applications. The system uses a spray coating technology that delivers consistent conformal coatings over 90° corners, KOH-etched cavities, V-grooves and lenses. The system can be equipped with modules for spray coating, developing, hard back, HMDS vapor priming, soft bake or cooling, and sender/receiver cassette plates. The fully automated cluster delivers reliable uniform coatings over high topography for wafers up to 200 mm. SUSS MicroTec AG, Munich, Germany, www.suss.com.