Die stacking in TQFP-ep and QFN package families is achieved by combining STATS ChipPAC’s high-volume manufacturing capability with its die-stacking and related enabling technologies. These package offerings incorporate the latest lead-free and halogen-free materials, die thinning, die attach, and fine-pitch wire-bonding technologies. Both packages are extremely thin (less than or equal to 1.0 mm), with exposed die paddles that can be soldered to the motherboard for enhanced thermal performance and grounding.
(November 11, 2004) Palo Alto, Calif.—Agilent Technologies announces that Exar Corp., a provider of high-performance, mixed-signal silicon solutions for the communications infrastructure, has purchased the Agilent 93000 SoC Series for testing its high-speed communication semiconductor devices. The Agilent 93000 SoC Series’ scalable architecture, flexibility and high performance enable Exar to test its products at gigabit speeds, maximizing its test equipment investment. Exar’s communication ICs are used in access, metro, and wide-area networks.