TI’s lead-free products are RoHS-compatible for all six RoHS substances. In addition to the substances restricted by RoHS, TI is addressing additional substances of concern through its “Green” mold compound initiative. TI defines “Green” to mean a mold compound that is lead-free and uses package materials that do not contain halogens, such as bromine or antimony above 0.1% of total product weight.
(November 10, 2004) Singapore—STATS ChipPAC says that it has expanded its die stacking technology to include two leadframe-based performance packages, called the exposed pad thin quad flat pack (TQFP-ep) and the quad flat no-lead (QFN). Die stacking in TQFP-ep and QFN-type packages offers high performance and low cost for consumer, communication, wireless handheld, and portable consumer applications.