2004 IWLPC Announces Best Paper Award

In his paper, entitled “Detecting and Analyzing Wafer Bump Voids with X-ray Inspection,” Frank discusses X-ray imaging technology that can detect and measure voids within solder bumps on chips and determine the viability of the component, based on pre-set threshold values. In this way, the X-ray inspection system converts 3-D voids to measurable 2-D images, enabling the system to calculate the ratio of the size of the void, or voids, within a solder bump to the total mass of the ball. The system can also determine the largest linear distance between two points in the void and compare the result with the diameter of the ball.

(December 8, 2004) Irvine, Calif. &#8212 Demonstrating its ongoing commitment to innovation in power semiconductors, Toshiba America Electronic Components Inc. (TAEC) announces TSSOP Advance, a new, smaller packaging technology that extends the company’s diverse packaging options for power MOSFETs.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.