Micro-lead-frame (MLF) is Amkor’s proprietary version of an IC package with the generic nomenclature of QFN. Amkor’s MLF package is a lead-frame-based, nearly chip-scale package with an exposed die paddle and leads on the bottom of the package, providing excellent thermal and electrical performance. Introduced in the late 1990s, Amkor’s MLF package has seen accelerating adoption by IC suppliers as a cost-effective alternative for conventional low lead-count packages. In the past 3 years, Amkor has shipped more than two billion MLF packages. According to Terry Davis, Amkor’s VP for MLF packages, “This agreement recognizes Amkor’s substantial investment in MLF technology and intellectual property.”
(December 14, 2004) Sunnyvale, Calif. — Keith Horn has been named senior VP of marketing and sales for Fujitsu Microelectronics America (FMA), with full responsibility for all FMA products and services, including packaging and foundry services. Horn moves to the new post from his position as FMA’s VP of marketing. Ray Abrishami, who has served as senior director of SoC engineering, now also assumes responsibility for FMA’s marketing organization, and reports to Horn.