FlipChip International to acquire assets of IC Services

December 9, 2004 – FlipChip International has agreed to acquire substantially all of the assets of IC Services Inc, a supplier of merchant semiconductor services with assets including substantial dicing, automated inspection, backgrind and tape/reel capabilities. FlipChip intends to integrate the assets into its wafer-level packaging and wafer-bumping services upon completion of the acquisition, expected by December 31.

Commenting on the agreement, Bob Forcier, president and CEO of FlipChip International, said, “We are very pleased to expand our technology investments with the proposed IC Services acquisition. The ability to provide dicing, tape and reel, and in-house backgrinding capability to our customers is part of our five-year roadmap for full services.”

Bruce Bowers, VP of FlipChip International will be the GM of the IC Services product line within FlipChip after the completion of the acquisition.

Mr. John Koch, Chief Executive Officer of IC Services, said, “We are fortunate to have developed a strong relationship with FlipChip International and we see great synergy with their business in the area of rapid response back-end services. We are very pleased that FlipChip International and IC Services have entered into this agreement.”


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