DALLAS, Texas—Texas Instruments (www.ti.com) has broken ground for another 300-mm wafer manufacturing facility, this one focusing on 65-nm production. The Richardson, Texas, fab is being built on a 92.4-acre greenfield site and will feature a more than 220,000-square-foot ISO Class 5 turbulent cleanroom.
The New Fab One facility will also include a 300,000-square-foot administration building, a 171,000-square-foot support wing, and a 166,000-square-foot mechanical wing. TI says its new Richardson fab will produce digital signal processing (DSP) and analog-based system-on-chip devices for wireless broadband and digital consumer applications.
New Fab One will join TI's other 300-mm fab, DMOS6, located in Dallas.
The company says it plans to construct the building and infrastructure ahead of market demands, followed by stages of equipment installation as demand increases. Environmental features include water recycling for manufacturing, waste heat recovery, natural day lighting, and solar water heating.