Renesas Tech to merge subsidiary unit Trecenti

December 22, 2004 – Renesas Technologies Corp., the world’s fifth-largest chipmaker, said Tuesday it will merge its wholly-owned unit, Trecenti Technologies Inc., into its parent entity in March 2005, according to the Nihon Keizai Shimbun America.

Trecenti is Renesas Technology’s 300mm wafer-equipped semiconductor manufacturing factory. Renesas, a joint venture between Hitachi Ltd. and Mitsubishi Electric Corp., said it will merge the unit in order to more effectively manage the frontend of the semiconductor manufacturing process, including such steps as chip design, lithography, etching, and the testing of microchips.

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