December 1, 2004 – The SEZ Group, Zurich, Switzerland, has announced it will expand its Yokohama, Japan-based customer application lab, which opened in July. In addition to the lab’s current demonstration and process support capabilities for backend assembly and packaging applications, including under-bump metallization etch, substrate etch, and wafer thinning, the facility will accommodate customers’ advanced cleaning requirements for 300mm wafers, sub-65nm geometries, copper interconnect, and advanced packages such as systems-on-chip, systems-in-package, and wafer-level chip-scale packages.