Study Shows Capacity Expansion Required to Meet Growth in Flip Chip and Wafer-level Package Demand

(December 6, 2004) Austin, Texas &#8212 TechSearch International’s new study, Flip Chip and Wafer Level Packaging Trends and Market Forecasts, projects a compound growth rate of over 28% in this market between 2004 and 2009. The report profiles drivers for the demand and requirements by market, investigates the state of the technology, and details the supply base. With a forecasted demand of 22 million 8-in. equivalent wafers (flip chip and wafer-level packaging) in 2007, TechSearch projects a need for capacity expansion to meet the requirements.

(December 7, 2004) Endicott, N.Y. &#8212 In late October 2004, Endicott Interconnect (EI) received their first U.S. Patent (6,809,269), titled “Circuitized Substrate Assembly and Method of Making Same,” a multilayer printed circuit which uses conductive paste to form electrical connections between layers of the structure.


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