Developed by Toshiba Corp. (Toshiba), the TSSOP Advance package is approximately 53% thinner at 0.75 mm (typ.), and requires approximately a 45% smaller mounting area than industry-standard SOP-8 packages. The TSSOP Advance package, combined with Toshiba’s Ultra High Speed U-MOS III (UHS U-MOS III) process technology, increases power dissipation by approximately 20%, compared to standard SOP-8 packaging, and enables high-speed switching and very low drain source on-state resistance.

The first device offered in TSSOP Advance packaging is the Toshiba TPCM8001-H, a 30-V, 20-A power MOSFET targeted for space-constrained synchronous rectification applications in DC/DC converters and in power supplies for mobile computers and portable electronics equipment.

In addition to this smaller, thinner TSSOP Advance package technology, Toshiba announces eight new higher voltage power MOSFETs, ranging from 40 to 250 V in the company’s SOP Advance packaging, first introduced in September 2003.

“Addressing the needs of designers of DC/DC converters used in power management has been a driving factor for Toshiba’s packaging developments for power semiconductors,” says Brach Cox, senior business development manager of the power devices discrete business unit at TAEC. “The new TSSOP Advance package provides a significantly smaller footprint and thinner profile for space-constrained applications, while providing high-speed switching, a small gate charge, and low drain source ON resistance for higher power efficiency.”

(December 9, 2004) Grenoble, France &#8212 The Spirit Consortium has announced the release of a specification aimed at giving system-on-chip (SoC) designers access to an industry standard for intellectual property re-use that will enable them to select, configure, and integrate standard-compatible IP from multiple vendors, using a range of different standard-compatible EDA tools and design environments.