January 17, 2005 – Hynix Semiconductor and Taiwan’s ProMOS Technologies have finally signed a strategic alliance agreement to jointly produce DRAM chips using 300mm wafer processing technology, according to the Korea Times. Under the agreement, Hynix will share its DRAM semiconductor processing technology and ProMOS will provide foundry service at its 300mm wafer plant in Taiwan.
Hynix did not disclose the financial terms and the specific timeframe of the alliance.
ProMOS will also supply its foundry equipment for Hynix’s Chinese plant, which is currently under construction. Through the alliance, Hynix will be able to produce chips in the Taiwanese firm’s 300mm wafer production facilities outside South Korea without any additional investment and ProMOS will gain much-needed customers for its foundry capacity as well as a technology partner to stay competitive in the market.
ProMOS ended its technological partnership with Infineon Technologies AG of Germany in early 2003 and has been searching for a new partner since then. The signing of the formal agreement comes after the two companies signed a memorandum of understanding last year.