Renesas, Casio to collaborate on device packaging technology

January 19, 2005 – Casio Computer Co. Ltd. and Renesas Technology Corp. have agreed to an arrangement whereby Casio will license its wafer level package (WLP) semiconductor device packaging technology to Renesas. The agreement marks the first time Casio has made its WLP technology available to another Japanese semiconductor device manufacturer.

The main points of the agreement are: 1) Casio will make its WLP technology available to Renesas on an ongoing basis, and Renesas will make active use of WLP in the fabrication of its semiconductor devices, and 2) Renesas will be authorized to manufacture and sell chip size package (CSP) products employing WLP, both on its own and through its subsidiaries.

Casio’s group company CASIO Micronics is already using Renesas Technology semiconductor devices that have been processed using WLP in its products.

Renesas Technology also has an in-house developed wafer process package (WPP) technology. Like WLP, it enables rerouting of the copper traces while in the wafer stage and is used in the manufacture of CSP devices. The license agreement with Casio will enable Renesas Technology to better meet the requirements of its customers by offering a broader array of package options.


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