Renesas to spend 40-50 billion yen to up 300mm wafer output

January 5, 2005 – Betting that demand for high-performance chips will remain strong despite the overall market slowdown, Renesas Technology Corp. next fiscal year plans to invest 40-50 billion yen (US$382-477 million) to increase its monthly production capacity for 300mm wafers, the Nihon Keizai Shimbun reported.

The investment will raise the firm’s 300mm wafer manufacturing capacity 20% to 18,000 units/month. Renesas, a joint venture between Hitachi Ltd. and Mitsubishi Electric Corp., will bolster the 300mm wafer production lines at Trecenti Technologies Inc., a wholly owned subsidiary Renesas is set to absorb in March. Trecenti is now operating near its full capacity of 15,000 units/month.

Renesas will by the end of this fiscal year install facilities in Trecenti’s plant capable of producing about 3000 units a month, aiming to bring them fully onstream by the end of fiscal 2005. The new lines will mostly fabricate wafers with a circuit width of 90nm and even narrower 65nm versions for digital electronics and system chips in mobile phones.


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