Samsung stacks 8 chips in multichip package

January 11, 2005 – Samsung Electronics yesterday announced it has developed chip packaging technology that enables it to stack eight bare memory chips in an ultra-slim single multichip package (MCP), said the Korea Times. The company’s MCP technology integrates combinations of eight flash memory and random access memory (RAM) chips into a tiny 11 x 14 x 1.4mm chip package.

The MCP encompasses two 1-Gbit NAND flash memory chips for data storage, two 256-Mbit mobile synchronous dynamic RAMs (SDRAMs) that serve as a temporary buffer, two 256-Mbit NOR flash memories, one 128-Mbit uni-transistor RAM (UtRAM), and one 64-Mbit UtRAM.

The chipmaker minimized the thickness of each memory chip to 50 microns, about half the thickness of a human hair. The height, or thickness, of the MCP (14mm) is the same as the height of four-chip MCPs currently available on the market.

The small footprint of the eight-chip MCP will facilitate mobile telecom equipment designers to further reduce the size of portable communication gadgets and add new functionality to next-generation mobile phones without sacrificing space or performance.


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