STATS ChipPAC Wins 2004 Top Regional Award for Bond Issue

In presenting the award to STATS ChipPAC, the editors at The Asset praised the bond issue as among the best-executed deals in 2004. The editors noted that the deal was upsized from the initial amount of US$165 million after it was ten times oversubscribed with a demand of about US$2 billion.

(January 19, 2005) Hsinchu, Taiwan &#8212 ChipMOS Technologies (Bermuda) Ltd. has reported unaudited consolidated revenue for the month of December 2004.


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