Tessera, Samsung settle suit

Jan. 27, 2005 – San Jose, CA – Tessera Technologies Inc., a developer and licensor of technology for semiconductor chip-scale and multichip packages (MCP), has signed a definitive settlement agreement and restated license agreement with Samsung Electronics, dismissing all claims and counterclaims of both companies. The agreements formalize the memorandum of understanding announced by the two companies in November, and mark the official end of the dispute regarding Samsung’s tape ball-grid array (TBGA) packages and TBGA MCPs, for which Samsung paid Tessera $6 million in past royalties last year.


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