Dr. Lee will be presenting “Lead-Free Soldering &#8212 Metallurgical Fundamentals, Reflow Applications, and Challenges” on Monday, February 21, 2005, from 8:30 a.m. to 4:30 p.m. His course will cover all the fundamental design considerations of lead-free alloys, with emphasis on metallurgical properties analysis. The performance of representative alloys on reflow soldering will be discussed, along with major challenges, with a focus on metallurgical causes.

(January 12, 2005) Zurich, Switzerland &#8212 The SEZ Group says that preliminary results show a falloff in net sales and orders in the fourth quarter compared to the third, but full-year net sales will set a record, up 78% to 303 million Swiss Francs ($243.8 million U.S.). The company believes that it has increased its share of the wet chemical wafer-cleaning market during the year, and also reiterated its expectation that full-year EBIT margin will come in at 14% to 15%.