IMEC, Axcelis form partnership for sub-45nm

February 15, 2005 – Axcelis Technologies Inc. today announced that the company’s new single wafer ion implantation technology platform has been purchased by IMEC, Europe’s largest independent nanoelectronics research center, for use in its sub-45nm device development activities.

In addition to the sale, Axcelis has become a partner in IMEC’s Industrial Affiliation Program (IIAP) for Planar devices, Ultra-shallow junctions, Silicides and Strain (PLUSS) to jointly develop advanced processes for device integration using Axcelis’ new single wafer, low energy technology.

IMEC chose Axcelis’ single wafer, low energy platform because it offers the ability to produce highly uniform implants across a broad range of energies, for mid-dose applications, including HALO processes. The system supports implant energies from 500eV all the way to 750keV.

As a member of the IIAP PLUSS, Axcelis joins other semiconductor companies in developing advanced processes for device integration. IMEC’s industrial affiliation programs foster joint R&D focused on a specific topic or technology area between industrial researchers and IMEC research teams. The concept is recognized worldwide as one of the most successful international partnership models for joint development of next-generation technologies.


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