Novel Wafer-cleaning Technologies to Support Advances

“Innovative wafer cleaning technologies, in particular, are crucial to meet the needs for finer fabrication, higher integration densities, and faster speeds of shrinking device features that support greater functionalities,” observes Frost & Sullivan research analyst Sivakumar Muthuramalingam.

(February 23, 2005) Flemington, N.J. &#8212 DEK has opened a new advanced stencil manufacturing facility in Singapore to improve delivery and increase the level of experience and expertise available to its customers in Asia. The 9000-sq.-ft. facility is expected to produce between 600 and 800 electroformed (Eform) stencils and 550 laser stencils per month for customers across the region.


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