Taiwanese chipmaker chooses Mattson system for new fab

February 9, 2005 – Mattson Technology Inc. has received orders for its Helios RTP system from a Taiwanese memory manufacturer to be put in its recently constructed 300mm fab in Hsin Chu. The Helios systems, scheduled to begin shipment in FH05, will be used to manufacture sub-100nm devices, including SDRAMs and DDR SDRAMs.

“Our customer, one of Taiwan’s largest DRAM manufacturers, selected Mattson’s Helios 300 mm RTP system because of its ability to meet the technology and throughput requirements for the manufacture of advanced chips,” said Ming Kao, Taiwan country manager for Mattson Technology.


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