This year’s categories include:
3-D Packaging Technology
Die Attach Equipment & Materials
Dispensing/Encapsulation/Molding/Underfill Equipment & Materials Environmentally Friendly Materials
Flip Chip Attach Equipment & Materials
Handling Equipment/Fixtures
Inspection/Imaging Equipment
Novel Package Design
Package Design Software & Equipment
Quality Assurance/Management Tools
Reflow Equipment
Specialized Advanced Packaging Equipment & Materials
Substrate & Submount Equipment & Materials
Surface Treatment Equipment & Materials
Testing Equipment
Thermal Management Technology
Wafer Dicing/Thinning Equipment
Wafer-level Packaging Equipment & Materials
Wire Bonding Equipment.

(March 7, 2005) San Jose, Calif. &#8212 Worldwide microchip sales of $18.3 billion in January were 0.5% below December 2004 sales of $18.4 billion, but 17.5% higher than January 2004 sales of $15.6 billion, the Semiconductor Industry Association (SIA) reports. SIA points out that January is usually a weak month for microchip sales, following the typically strong holiday season.