AIT Qualifies SOIC Packages for Next-generation Automotive, Power Applications

As next-generation developers begin to demand green package solutions with higher reliability ratings, AIT has leveraged its expertise and capabilities to aggressively qualify its solution to better serve the needs in the marketplace. This availability will allow AIT to capture additional market share with developers of next-generation automotive and power-sensitive applications.

(March 9, 2005) Singapore &#8212 STATS ChipPAC announces that it has qualified a new strip-testing process, enabling customers with high-performance mixed-signal and RF devices to migrate from a single-unit test process to a strip test process that improves throughput and reduces the cost of test.


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