Amkor and Credence together have created a test development floor in Amkor’s newly completed Test Center of Excellence in Singapore, and have installed Sapphire test systems and dedicated engineering resources to develop test solutions for their mutual customers. Both companies will share best practices to blend Amkor’s packaging technology with Credence’s Sapphire SoC expertise to quickly address their customers’ cost-of-test and time-to-market demands.

(March 24, 2005) North Reading, Mass. &#8212 Teradyne’s new ClearVue 3-D X-ray imaging technology for detecting PCB solder and production defects uses a patented Off-Center Tomosynthesis imaging method, making it suitable for densely packed single- or double-sided boards that use BGA-style components, as well as problematic loss of electrical or optical access.