Dow Corning Launches Lid-Seal Adhesive for Flip Chip Packages

EA-6700’s chemistry improves the long-term reliability of flip chip devices by offering thermal stability and moisture-resistance properties. The formula lowers outgassing and helps reduce voiding attributed to residual moisture within substrates, leading to improved adhesion to ceramic, organic, and other substrates. As with previous generations of Dow Corning adhesives, EA-6700 maintains a low modulus, allowing it to absorb stress when used between two materials (such as laminate substrates and nickel/copper lids) with differing thermal expansion coefficients.

(March 2, 2005) Hong Kong and Pleasanton, Calif. &#8212 ASAT Holdings Limited announces that SigmaTel Inc. has completed qualification and is ramping production on lead-free and green fine-pitch BGAs (fpBGAs) in ASAT’s new manufacturing facility in Dongguan, China.

SigmaTel offers a wide range of mixed-signal ICs that convert real-world analog signals, such as music and voice, to digital signals required by computers for processing and playback. Their portable audio system-on-chip (SoC) product line addresses the digital-to-analog conversion requirements and controller functionality. Many MP3 players in the market use SigmaTel’s audio SoC chips that are assembled and tested at ASAT.


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