DuPont Photomasks receives Spansion award for yield improvements

March 25, 2005 – DuPont Photomasks Inc. has received a Spotlight Award from flash memory device maker Spansion LLC for helping Spansion’s FAB25 in Austin, TX, enhance wafer yield. Spansion’s award recognizes DuPont Photomasks’ role in a joint-development project aimed at boosting yield by targeting improvement of layer-to-layer registration when chip designs are etched on wafers. Spansion, formerly known as FASL LLC, is the flash memory subsidiary of AMD and Fujitsu Limited.

Layer-to-layer registration refers to how closely the images produced by individual photomasks in a set align with one another as they are used to print various layers of the semiconductor. Improving layer-to-layer registration improves memory devices’ reliability, programming performance, and their ability to remain charged. Working with a team of lithography and metrology engineers from Spansion, DuPont Photomasks was able to provide products with registration tolerances below 15nm using an ALTA 4300 laser-based pattern generation system.

“These improvements in tolerance translate into better device performance, which helps us, our OEM customers and, ultimately, end users of the products that our flash memory devices go into,” said Greg Goodwin, strategic technology manager for Spansion LLC.


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