Entegris has also announced two new products: a package aimed at reducing particle contamination of photomasks, and a new SMIF pod for reticles. The new SMP625 mask package not only reduces particle contamination of masks, it also improves protection of reticles from damage during shipment. The package has a positive locking latch system, an advanced retainer system with no moving parts, a molded-in hinge, and full automation compatibility. The features aid in reducing particle generation, reducing the chance of manufacturing or assembly errors and improving photolithography cell productivity, according to the company. The SMP625 also is compatible with mask package platforms.

(March 1, 2005) Midland, Mich. &#8212 Dow Corning introduces EA-6700 microelectronic adhesive, a new lid-seal material based on a chemistry that is suited for the latest generations of flip chip semiconductor packages. Adhesives for lid assembly, also referred to as cap assembly, are integral to the production of flip chip devices. To ensure device reliability, lid-seal adhesives face the challenge of withstanding high humidity, temperature cycling, and extreme operating conditions.