EV Group ships Gemini production wafer bonder to DALSA

March 24, 2005 – EV Group today announced that it has successfully installed a Gemini production wafer bonder at DALSA Corp.’s Semiconductor Division in Bromont, Quebec, Canada. The Gemini wafer bonder is designed for alignment and low-temperature plasma bonding for a wide variety of wafer types and sizes.

DALSA’s Semiconductor Division will use the Gemini to leverage its patented and patent-pending low-temperature wafer bonding and wafer-level packaging technologies. The production tool’s flexibility will also enable the company to implement these and other strategies for very low-temperature direct-wafer bonding of CMOS-friendly substrates.

As the strategic supplier for MEMS wafer-bonding and thick-polymer lithography semiconductor production equipment for DALSA, EV Group previously installed a Hercules thick-polymer lithography tool customized for DALSA’s specifications at its foundry in Bromont.

The Hercules system has been qualified to process advanced chemically amplified thick photopolymers for its MEMS processes involving DRIE, electroforming and wafer bonding. The Hercules is a customizable system for MEMS production that integrates coat/align-expose/develop stations for fully automated and integrated production.

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