March 14, 2005 – EV Group has announced that it has received the Austrian Innovation Award 2004 from the Austrian Ministry of Economic Affairs. The prestigious national prize recognizes EV Group’s technology leadership in producing “a system for the production of the next generation of high-performance processors-SOI production bonder.”
EV Group competed for the national award with 480 companies from Austria. The company’s SOI wafer-bonding technology has been commercialized in the company’s EVG850 SOI production bonding system.
“For EV Group, the Austrian Innovation Award once again confirms the success of the company’s strategy to constantly develop new technologies and grow with them from niche applications to volume-production markets,” said Dr. Peter Podesser, CEO of EV Group. “However, research and development are not the only decisive factors for our success. In the end, it is our team of highly qualified and motivated employees who transfer research into products and success at our markets.”