Fujitsu uses Tessera’s chip scale packaging (CSP) technology in ASICs, ASSPs, and system-on-chips (SOCs), among other semiconductor devices, for the computing, networking, communications, automotive, and consumer markets.

“Tessera is delighted to announce this licensing agreement with Fujitsu,” says Kirk Flatow, Tessera’s senior VP of marketing and sales. “Fujitsu’s cutting-edge semiconductor products are recognized around the world for their technical excellence. Tessera is proud that its advanced packaging technology is enabling Fujitsu to provide small, reliable, and technically advanced semiconductor products to the market at low cost.”

The technology available to Fujitsu covers a broad range of chip scale and multi-chip package types, including IC devices packaged in face-down, face-up, fold-over, stacked, and system-in-package (SiP) formats, using many different types of materials, including packages using either tape and laminate substrates. These package types are marketed by Tessera as MicroBGA for face-down orientations, MicroBGA-F for face-up orientations, and MicroZ for multi-chip solutions. Tessera’s intellectual property is used in many forms of advanced packaging, covering an extensive range of materials and assembly processes.