Amkor, ASAT Enter into Licensing Agreement

(April 6, 2005) Chandler, Ariz. and Hong Kong &#8212 Amkor Technology and ASAT Holdings Limited have entered into a cross-licensing agreement, under which ASAT will provide Amkor with a license for its thin array plastic package (TAPP) semiconductor package technology, and Amkor will provide ASAT with a license for its flip chip semiconductor package technology. The multi-year agreement also covers licenses for intellectual property rights and the transfer of associated packaging technologies.

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