Elpida has placed orders for SEZ single-wafer tools

April 7, 2005 – The SEZ Group today announced that Elpida Memory Inc. has placed orders for multiple SEZ 323 spin processing tools.

Currently in the process of expanding its manufacturing capacity for advanced DRAM devices, Elpida will tap the SEZ systems for backside and bevel-edge cleaning of 300-mm product wafers.

“We are very pleased that Elpida has chosen us for this important capacity expansion, underscoring the fact that memory manufacturers are increasingly transitioning from batch processing to our single-wafer technology,” said Masaaki Yashiro, COO of SEZ Japan.

The SEZ 323 was selected by Elpida for its capacity expansion based on its ability to flexibly accommodate multiple chemicals, together with its proven stability in volume production environments.


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