EV Group installs system at SMI

April 29, 2005 — EV Group, a Sharding, Austria, supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems, announced it installed a low-temperature wafer bonding system at Silicon Microstructures Inc. in Milpitas, Calif., a high-volume provider of silicon pressure and inertial sensors for automotive, medical, and industrial applications.

The EVG810LT LowTemp Plasma Activation System will be used in new system-level products that combine high-performance bulk and surface MEMS structures with CMOS and EEPROM circuits from SMIĀ“s parent company ELMOS Semiconductor AG.


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