EV Group Installs Wafer Bonder at SMI

The EVG810LT LowTemp plasma activation system, installed earlier this year at SMI’s Milpitas, Calif.-based fabrication facility, will be used in many new system-level products that combine high-performance bulk and surface MEMS structures with CMOS and EEPROM circuits from SMI’s parent company, ELMOS Semiconductor AG. MEMS integration with advanced circuitry is a critical part of SMI’s strategy to provide inertial products, as well as pressure sensors for low pressure ranges.

(April 28, 2005) Herndon, Va. &#8212 The International Electronics Manufacturing Initiative (iNEMI) announces that most of its OEM and EMS members strongly support unique part-number use for RoHS-compliant components, including Alcatel, Celestica, Cray Inc., Dell, Delphi, HP, Intel Corp., Jabil Circuit, Lucent Technologies, Microsoft, Plexus Corp., Sanmina-SCI Corp., Solectron Corp., StorageTek, and Sun Microsystems.


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