“Customers value the total power system designs we are able to give them, and are seeking the same level of solutions in other areas, such as two- and three-phase motor control and motion control,” says Ole-Petter Brusdal, Fairchild’s vice president of sales and marketing in Europe. “These address industrial and consumer white goods applications—areas that are growing quickly in Europe. As The Power Franchise, our strategy is to constantly upgrade and extend the Global Power Resource design and application labs to meet the needs of our customers.”
(May 11, 2005) Singapore and Fremont, Calif. — In Q3 2005, STATS ChipPAC Ltd. will offer 300-mm electroplated wafer-bumping services, completing the company’s full turnkey service offering. The company has also expanded its solder-alloy options for its present flip chip portfolio, and enhanced its design, simulation, and characterization capabilities for high-end flip chip packages.