Summit Unveils New 100% Tin Reflow Process

Summit’s process plates pure tin over copper or brass substrates, extending components’ shelf lives and solderability, and eliminating tin whiskering, which can be potentially detrimental. The process also eliminates the need for organic brighteners or leveling agents that are harmful to the environment, and are both costly. The end result is a durable, low-stress, fully bright tin coating, meeting thermal cycling challenges and other environmental factors.


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