Unaxis slashes costs, workforce

May 12, 2005 – Swiss chip equipment manufacturer Unaxis Corp. has announced “extensive restructuring” within its Leybold Vacuum business, with cutbacks in staff and development expected to cost more than $33 million in one-time charges.

The move, which will reduce its workforce by about 15% (220 employees) over the next 18 months, is an effort to cut costs and achieve 10% operating margins by 2007.

In December Unaxis announced a 130-140 million euro effort to refocus on its thin-film and vacuum technology businesses, accelerate transition of assembly and packaging capacity to Asia, and absorb or divest its display technology division.

In other news, Unaxis Wafer Processing, a division of Unaxis, has announced it will supply the Korea Advanced Nano Fab Center with 6 Versaline tools, the newest production system in the Unaxis family of wafer processing equipment.

Unaxis Wafe Processing said Versaline, a modular platform for dry etching applications, can be customized to specific requirements and budgets. Built on the company’s plasma process, the Versaline’s specialized ICP, RIE, PECVD and PVD modules provide advanced solutions for applications including LEDs, HBTs, HEMTs, optoelectronics, and MEMS.


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