“Our agreement with LSI Logic represents another important milestone in the continued growth of our flip chip business,” says Harry R. Rozakis, ASAT’s CEO. “By adding LSI Logic’s proven low-k silicon technology to the leading-edge flip chip process we licensed from Amkor earlier this year, ASAT will have the technological capabilities to meet current and future customer requirements in the growing flip chip market.”

“By bringing new technologies into the manufacturing domain through licensing and partnerships, LSI Logic is enhancing its packaging manufacturing capabilities to better serve our worldwide customer base,” says Maniam Algarathanam, LSI Logic VP of Advanced Package Development and Assembly. “ASAT’s licensing of LSI Logic’s advanced flip chip assembly process technology for deep sub-micron copper/low-k technology provides assembly suppliers with advanced packaging manufacturing technology, and reinforces LSI Logic’s packaging leadership position.”