CORWIL Adds 300-mm Wafer Dicing Capability

(June 17, 2005) Milpitas, Calif. &#8212 Contract IC assembly services provider CORWIL Technology Corp. has added 300-mm wafer dicing capability to its offering. Both bumped and non-bumped wafers are being processed in CORWIL’s fully automatic, dual-spindle Disco system, complementing CORWIL’s existing high-volume wafer dicing, pick-and-place, and die inspection services, wire bond and flip chip IC assembly services, and wafer thinning and polishing services.

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