June 27, 2005 – IBM Japan Ltd. and chipmaker Niigata Seimitsu Ltd. will collaborate to mass-produce package-on-package (PoP) mixed components, according to the Asia Pulse Businesswire. The two companies will design a line that mixes memory and logic in a configuration that is thinner than 1.4mm.
Niigata Seimitsu will begin mass-producing the PoP components next year and expects to generate sales of 3.5 billion yen in that first year. The company predicts that the total market for PoP components will grow to be worth 100 billion yen in 2009 and hopes to capture half of that market.
By 2009, approximately 5 billion yen (US$45.9 million) will be invested and ultimately more than 10 billion yen will be invested to prepare productions lines to make PoP solutions for makers of cellular phones and consumer electronics products like digital cameras and portable music players.
The advantage of PoP designs is that the chips can be tested before they are stacked, so yields are higher than with SiP components and costs can be lowered.